Two leading chipmakers Sony and NXP Semiconductors have signed an MoU (Memorandum of Understanding) to form a joint venture for the development of an Integrated Circuit(IC) for the RFID-based Near Filed Communication (NFC).
The MoU brings NXP’s Mifare technology and Sony’s FeliCa Platform of a single chip for the formation of IC.
The Integrated Chip would immensely benefit the NFC applications like contactless payments, smart cards such as Oyster card that is being used for making payments in the London’s Underground subway or Hong Kong’s Octopus mass-transit card. The joint venture targets Asian and European markets.
